|
|
¸ÞÀÎ > űװ˻ö > °ü·Ã±â»ç
|
|
Áö¸à½º
|
|
|
´Ù¸¥ Ç¥±â / ¼Ò¼ÓÁ¦Ç° : Áö¸à½º PLM ¼ÒÇÁÆ®¿þ¾î PLM Product Lifecycle Management Siemens PLM Software |
|
|
|
|
¼±ÅÃÇϽŠ±â»ç 'Áö¸à½º, LMS »ç¿îµå Ä«¸Þ¶ó Ãâ½Ã' ÀÇ ´Ù¸¥ ÅÂ±× º¸±â
|
|
µðÁöŻī¸Þ¶ó |
ű׸¦ Ŭ¸¯ÇϽøé ÅÂ±×¿Í °ü·ÃµÈ ±â»ç¸¦ º¸½Ç ¼ö ÀÖ½À´Ï´Ù |
|
|
|
°ü·Ã±â»ç : 'Áö¸à½º' ¿Í °ü·ÃÀÖ´Â ±â»ç
|
|
|
|
|
|
Áö¸à½º, ¸ð¹ÙÀϵå¶óÀ̺꿡 µðÁöÅÐ Æ®À© ±â¼ú Á¦°ø
Áö¸à½º µðÁöÅÐ Àδõ½ºÆ®¸® ¼ÒÇÁÆ®¿þ¾î (Siemens Digital Industries Software)´Â ´ë¸¸ÀÇ ¸ðºô¸®Æ¼ ±â¾÷ ¸ð¹ÙÀϵå¶óÀ̺ê(MobileDrive)°¡ Siemens Xcelerator Æ÷Æ®Æú¸®¿À¿Í Æ÷°ýÀûÀÎ µðÁöÅÐ Æ®À© ±â¼úÀ» »ç¿ëÇÏ¿© ¸ð..
[±âŸµðÁöÅ»] / [´º½º] 2023-03-27
|
|
|
|
Áö¸à½º, TSMC¿Í Çù¾÷ ÅëÇØ 3nm Á¦Ç° ÀÎÁõ ¹× ±â¼úÇõ½Å ¹ßÇ¥
Áö¸à½º µðÁöÅÐ Àδõ½ºÆ®¸® ¼ÒÇÁÆ®¿þ¾î, Áö¸à½º EDA »ç¾÷ºÎ´Â ¿À´Ã, ÀÚ»çÀÇ ±¤¹üÀ§ÇÑ EDA ¼Ö·ç¼ÇÀÌ TSMC ÆÄ¿îµå¸®ÀÇ ÃֽŠ°øÁ¤ ±â¼ú¿¡ ´ëÇØ ÀÎÁõÀ» ȹµæÇß´Ù°í ¹ßÇ¥Çß´Ù.
¾÷°è¸¦ ¼±µµÇÏ°í ÀÖ´Â Áö¸à½ºÀÇ ..
[PC¼Ò½Ä] / [´º½º] 2022-11-01
|
|
|
|
Áö¸à½º, Å×¼¾Æ® ¸ÖƼ-´ÙÀÌ(Tessent Multi-die) Á¦Ç° ¹ßÇ¥
Áö¸à½º µðÁöÅÐ Àδõ½ºÆ®¸® ¼ÒÇÁÆ®¿þ¾î, Áö¸à½º EDA »ç¾÷ºÎ´Â ¿À´Ã, 2.5D ¹× 3D ¾ÆÅ°ÅØó ±â¹Ý Â÷¼¼´ë ICÀÇ Áß¿ä DFT(Design-for-Test: ¼³°è´Ü°è¿¡¼ ĨÀÇ °øÁ¤»ó °áÇÔÀÌ ÀÖ´ÂÁö üũ) ÀÛ¾÷ ¼Óµµ¸¦ ³ôÀÌ°í ´Ü¼øÈÇÒ ..
[±âŸµðÁöÅ»] / [´º½º] 2022-10-20
|
|
|
°ü·Ã °Ô½Ã¹° : 'Áö¸à½º' ¿Í °ü·ÃÀÖ´Â Ä¿¹Â´ÏƼ °Ô½Ã¹°
|
|
|
|
°ü·Ã Ä¿¹Â´ÏƼ °Ô½Ã¹°ÀÌ ¾ø½À´Ï´Ù.
|
|
|
|
2014³â 1¿ù
ÁÖ°£ È÷Æ® ·©Å·
|
|
|
|
|
|
ÀÌ ±â»çÀÇ °ü·Ã Á¦Ç°ÀÌ ¾ø°Å³ª, ½ºÆ庸µå³ª¶ó Ãë±Þ Á¦Ç°ÀÌ ¾Æ´Õ´Ï´Ù.
½ºÆ庸µå³ª¶ó DB´Â CPU, ¸ÞÀκ¸µå, VGA, RAM, ODD, HDD, SSD¿¡ ÇÑÇÏ¿© Á¦°øµË´Ï´Ù. |
|
|
|
|
|
½Ç½Ã°£ ´ñ±Û
|
|
|
|
|
|
|
|