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- 0.15-micron manufacturing process
- 76M transistors
- 860 ball HSBGA package (TSMC's latest packaging technology)
- 4 pixel rendering pipelines, can process two textures per pipeline
- Full 256-bit DDR memory interface (up to 20GB/s of memory bandwidth w/ 312.5MHz DDR)
- Up to 256MB of memory on-board
- AGP 4X support
- Full DX8 pixel and vertex shader support
- Deliver over 170Gflops and one TeraOp of programmable graphics performance
Ãâó : Vr-zone
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